RF IC testing and test engineering, end to end
From the first characterization run to a production program running at your OSAT, and the test-time and yield work after that.
RF IC testing
Production and engineering test of RF and RF front-end devices, with measurements calibrated to the device pins.
- Low-noise amplifiers, power amplifiers, switches and tuners
- Front-end modules and transceivers
- S-parameters, gain, noise figure, P1dB, IP3
- Harmonics, ACLR, EVM and modulation quality
- Multisite RF test strategies
Test program development
Production test programs written, debugged and released on the platform you will run in production.
- Test plan from datasheet and specification
- Program development on industry-standard ATE
- Bench-to-ATE correlation and guard-banding
- Release package and hand-off to your OSAT
- Program conversion between test platforms
Device characterization
Bench and ATE characterization that shows how your silicon really performs, before you commit to volume.
- Performance across voltage, temperature and process corners
- Datasheet and specification support
- Distribution and capability (Cpk) analysis
- Failure-analysis support
- Characterization reports your customers can trust
Test engineering
The hardware and measurement science that RF test depends on.
- Load-board / DIB design and verification
- Socket and contactor selection
- Calibration and de-embedding methods
- Gauge repeatability and reproducibility (GR&R)
- Test-hardware bring-up
ATE production support and optimization
For programs already in production: lower cost per device and higher yield.
- Test-time reduction and multisite efficiency
- Yield analysis and site-to-site correlation
- Production data analytics
- On-site support at OSATs in Vietnam
- Engineering changes and program maintenance
A clear path from device to production
Every engagement follows the same five steps, with a deliverable and a review at each one.
Discover
Device, specification, volumes, target platform and OSAT.
Plan
Test plan, hardware plan, schedule and acceptance criteria.
Develop
Load board, program and characterization on real silicon.
Correlate
Bench-to-ATE and site-to-site correlation, with documented limits.
Release & support
Hand-off to production, then test-time and yield improvement.
Built for the companies designing and producing chips in Vietnam, and beyond
We work with fabless companies that decide test locally, design centers of global semiconductor firms, and OSATs whose customers need test development the OSAT does not provide. We also support customers outside Vietnam who want an experienced, cost-effective RF test team in Asia.
Start with a short technical call
Share your device and timeline. We will tell you honestly what we can do, how long it will take and what we need from you.